What is 3D stacking technology?

3D stacking technology is the use of stacking technology or through interconnection and other micromachining technologies to form three-dimensional integration in the Z-axis direction of chips or structures, signal connections, and wafer-level, chip-level and silicon lid packaging with different functions. 3D stack processing technology for packaging and reliability technologies. This technology is used for microsystem integration and is an advanced system-in-package manufacturing technology developed after System-on-Chip (SOC) and Multi-Chip Module (MCM).

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