XCVU9P-2FLGB2104I FPGA,VIRTEX ULTRASCALE,FCBGA-2104
Product Information
|
TYPENo. of Logic Blocks: |
2586150 |
|
No. of Macrocells: |
2586150Macrocells |
|
FPGA Family: |
Virtex UltraScale Series |
|
Logic Case Style: |
FCBGA |
|
No. of Pins: |
2104Pins |
|
No. of Speed Grades: |
2 |
|
Total RAM Bits: |
77722Kbit |
|
No. of I/O's: |
778I/O's |
|
Clock Management: |
MMCM, PLL |
|
Core Supply Voltage Min: |
922mV |
|
Core Supply Voltage Max: |
979mV |
|
I/O Supply Voltage: |
3.3V |
|
Operating Frequency Max: |
725MHz |
|
Product Range: |
Virtex UltraScale XCVU9P |
|
MSL: |
- |
Product Introduction
BGA stands for Ball Grid Q Array Package.
The memory encapsulated by BGA technology can increase the memory capacity to three times without changing the volume of memory, BGA and TSOP
Compared with, it has a smaller volume, better heat dissipation performance and electrical performance. BGA packaging technology has greatly improved the storage capacity per square inch, using BGA packaging technology memory products under the same capacity, the volume is only one-third of TSOP packaging; Plus, with tradition
Compared with the TSOP package, the BGA package has a faster and more effective heat dissipation way.
With the development of integrated circuit technology, the packaging requirements of integrated circuits are more stringent. This is because the packaging technology is related to the functionality of the product, when the frequency of the IC exceeds 100MHz, the traditional packaging method may produce the so-called "Cross Talk• phenomenon, and when the number of pins of the IC is greater than 208 Pin, the traditional packaging method has its difficulties. Therefore, in addition to the use of QFP packaging, most of today's high pin count chips (such as graphics chips and chipsets, etc.) are switched to BGA(Ball Grid Array PackageQ) packaging technology. When BGA appeared, it became the best choice for high-density, high-performance, multi-pin packages such as cpus and south/North bridge chips on motherboards.
BGA packaging technology can also be divided into five categories:
1.PBGA (Plasric BGA) substrate: Generally 2-4 layers of organic material composed of multi-layer board. Intel series CPU, Pentium 1l
Chuan IV processors are all packaged in this form.
2.CBGA (CeramicBCA) substrate: that is, ceramic substrate, the electrical connection between the chip and the substrate is usually flip-chip
How to install FlipChip (FC for short). Intel series cpus, Pentium l, ll Pentium Pro processors are used
A form of encapsulation.
3.FCBGA (FilpChipBGA) substrate: Hard multi-layer substrate.
4.TBGA (TapeBGA) substrate: The substrate is a ribbon soft 1-2 layer PCB circuit board.
5.CDPBGA (Carty Down PBGA) substrate: refers to the low square chip area (also known as the cavity area) in the center of the package.
BGA package has the following features:
1).10 The number of pins is increased, but the distance between pins is much greater than that of QFP packaging, which improves the yield.
2 ).Although the power consumption of BGA is increased, the electric heating performance can be improved due to the controlled collapse chip welding method.
3). The signal transmission delay is small, and the adaptive frequency is greatly improved.
4). The assembly can be coplanar welding, which greatly improves the reliability.
