IC chip failure analysis

IC chip failure analysis, IC chip integrated circuits cannot avoid failures in the process of development, production and use. With the improvement of people’s requirements for product quality and reliability, failure analysis work is becoming more and more important. Through chip failure analysis, IC chip of designers can find defects in design, inconsistencies in technical parameters, improper design and operation, etc. The significance of failure analysis is mainly manifested in:

In detail, the main significance of IC chip failure analysis is shown in the following aspects:

1. Failure analysis is an important means and method to determine the failure mechanism of IC chips.

2. Fault analysis provides necessary information for effective fault diagnosis.

3. Failure analysis provides design engineers with continuous improvement and improvement of chip design to meet the needs of design specifications.

4. Failure analysis can evaluate the effectiveness of different test approaches, provide necessary supplements for production testing, and provide necessary information for optimization and verification of the testing process.

The main steps and contents of failure analysis:

◆Integrated circuit unpacking: While removing the integrated circuit, maintain the integrity of the chip function, maintain die, bondpads, bondwires and even lead-frame, and prepare for the next chip invalidation analysis experiment.

◆SEM scanning mirror/EDX composition analysis: material structure analysis/defect observation, conventional micro-area analysis of element composition, correct measurement of composition size, etc.

◆Probe test: The electrical signal inside the IC can be obtained quickly and easily through the micro-probe. Laser: Micro-laser is used to cut the upper specific area of ​​the chip or wire.

◆EMMI detection: EMMI low-light microscope is a high-efficiency fault analysis tool, which provides a high-sensitivity and non-destructive fault location method. It can detect and localize very weak luminescence (visible and near-infrared) and capture leakage currents caused by defects and anomalies in various components.

◆OBIRCH application (laser beam-induced impedance value change test): OBIRCH is often used for high-impedance and low-impedance analysis inside IC chips, and line leakage path analysis. Using the OBIRCH method, defects in circuits can be effectively located, such as holes in lines, holes under through holes, and high resistance areas at the bottom of through holes. Subsequent additions.

◆ LCD screen hot spot detection: Use the LCD screen to detect the molecular arrangement and reorganization at the leakage point of the IC, and display a spot-shaped image different from other areas under the microscope to find the leakage point (fault point greater than 10mA) that will trouble the designer in the actual analysis. Fixed-point/non-fixed-point chip grinding: remove the gold bumps implanted on the Pad of the LCD driver chip, so that the Pad is completely undamaged, which is conducive to subsequent analysis and rebonding.

◆X-Ray non-destructive testing: Detect various defects in IC chip packaging, such as peeling, bursting, voids, wiring integrity, PCB may have some defects in the manufacturing process, such as poor alignment or bridging, open circuit, short circuit or abnormality Defects in connections, integrity of solder balls in packages.

◆SAM (SAT) ultrasonic flaw detection can non-destructively detect the structure inside the IC chip package, and effectively detect various damages caused by moisture and thermal energy, such as O wafer surface delamination, O solder balls, wafers or fillers There are gaps in the packaging material, pores inside the packaging material, various holes such as wafer bonding surfaces, solder balls, fillers, etc.