What is Ball Grid Q Array Package

Also called CPAC (globe top pad array carrier). Ball contact array, one of the surface mount packages. On the back of the printed substrate, spherical bumps are made in an array to replace the pins, and the LSI chip is assembled on the front of the printed substrate, and then sealed with molding resin or potting method. Also known as bump array carrier (PAC). The pins can exceed 200, and it is a package for multi-pin LSI. The package body can also be made smaller than QFP (Quad Flat Package). For example, a 360-pin BGA with a pin center distance of 1.5mm is only 31mm square; a 304-pin QFP with a pin center distance of 0.5mm is 40mm square. And BGA doesn't have to worry about pin deformation like QFP.

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