XCZU19EG-2FFVC1760E 100% New & Original DC To DC Converter & Switching Regulator Chip

Compared with electrons, photons have no static mass, weak interaction, strong anti-interference ability, and are more suitable for information transmission.  Optical interconnection is expected to become the core technology to break through the power consumption wall, storage wall and communication wall.  Illuminant, coupler, modulator, waveguide devices are integrated into the high density optical features such as photoelectric integrated micro system, can realize quality, volume, power consumption of high density photoelectric integration, photoelectric integration platform including III - V compound semiconductor monolithic integrated (INP) passive integration platform, silicate or glass (planar optical waveguide,  PLC) platform and silicon-based platform.  

InP platform is mainly used for the production of laser, modulator, detector and other active devices, low technology level, high substrate cost;  Using PLC platform to produce passive components, low loss, large volume;  The biggest problem with both platforms is that the materials are not compatible with silicon-based electronics.  The most prominent advantage of silicon-based photonic integration is that the process is compatible with CMOS process and the production cost is low, so it is considered to be the most potential optoelectronic and even all-optical integration scheme