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XC7Z100-2FFG900I – Integrated Circuits, Embedded, System On Chip (SoC)

short description:

The Zynq®-7000 SoCs are available in -3, -2, -2LI, -1, and -1LQ speed grades, with -3 having the highest performance. The -2LI devices operate at programmable logic (PL) VCCINT/VCCBRAM =0.95V and are screened for lower maximum static power. The speed specification of a -2LI device is the same as that of a -2 device. The -1LQ devices operate at the same voltage and speed as the -1Q devices and are screened for lower power. Zynq-7000 device DC and AC characteristics are specified in commercial, extended, industrial, and expanded (Q-temp) temperature ranges. Except the operating temperature range or unless otherwise noted, all the DC and AC electrical parameters are the same for a particular speed grade (that is, the timing characteristics of a -1speed grade industrial device are the same as for a -1 speed grade commercial device). However, only selected speed grades and/or devices are available in the commercial, extended, or industrial temperature ranges. All supply voltage and junction temperature specifications are representative of worst-case conditions. The parameters included are common to popular designs and typical applications.


Product Detail

Product Tags

Product Attributes

TYPE DESCRIPTION
Category Integrated Circuits (ICs)

Embedded

System On Chip (SoC)

Mfr AMD
Series Zynq®-7000
Package Tray
Product Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
Primary Attributes Kintex™-7 FPGA, 444K Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 212
Base Product Number XC7Z100

Documents & Media

RESOURCE TYPE LINK
Datasheets XC7Z030,35,45,100 Datasheet

Zynq-7000 All Programmable SoC Overview

Zynq-7000 User Guide

Product Training Modules Powering Series 7 Xilinx FPGAs with TI Power Management Solutions
Environmental Information Xiliinx RoHS Cert

Xilinx REACH211 Cert

Featured Product All Programmable Zynq®-7000 SoC

TE0782 Series with Xilinx Zynq® Z-7035/Z-7045/Z-7100 SoC

PCN Design/Specification Mult Dev Material Chg 16/Dec/2019
PCN Packaging Mult Devices 26/Jun/2017

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001

 

SoC

Basic SoC architecture

A typical system-on-chip architecture consists of the following components:
- At least one microcontroller (MCU) or microprocessor (MPU) or digital signal processor (DSP), but there can be multiple processor cores.
- The memory may be one or more of RAM, ROM, EEPROM and flash memory.
- Oscillator and phase-locked loop circuitry for providing time pulse signals.
- Peripherals consisting of counters and timers, power supply circuits.
- Interfaces for different standards of connectivity such as USB, FireWire, Ethernet, universal asynchronous transceiver and serial peripheral interfaces, etc..
- ADC/DAC for conversion between digital and analogue signals.
- Voltage regulation circuits and voltage regulators.
Limitations of SoCs

Currently, the design of SoC communication architectures is relatively mature. Most chip companies use SoC architectures for their chip manufacturing. However, as commercial applications continue to pursue instruction co-existence and predictability, the number of cores integrated into the chip will continue to increase and bus-based SoC architectures will become increasingly difficult to meet the growing demands of computing. The main manifestations of this are
1. poor scalability. soC system design starts with a system requirements analysis, which identifies the modules in the hardware system. In order for the system to work correctly, the position of each physical module in the SoC on the chip is relatively fixed. Once the physical design has been completed, modifications have to be made, which can effectively be a redesign process. On the other hand, SoCs based on bus architecture are limited in the number of processor cores that can be extended on them due to the inherent arbitration communication mechanism of the bus architecture, i.e. only one pair of processor cores can communicate at the same time.
2. With a bus architecture based on an exclusive mechanism, each functional module in a SoC can only communicate with other modules in the system once it has gained control of the bus. As a whole, when a module acquires bus arbitration rights for communication, other modules in the system must wait until the bus is free.
3. Single clock synchronisation problem. The bus structure requires global synchronisation, however, as the process feature size becomes smaller and smaller, the operating frequency rises rapidly, reaching 10GHz later, the impact caused by the connection delay will be so serious that it is impossible to design a global clock tree, and because of the huge clock network, its power consumption will occupy most of the total power consumption of the chip.


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