Brand new genuine original IC stock Electronic Components Ic Chip Support BOM Service TPS22965TDSGRQ1
Product Attributes
| TYPE | DESCRIPTION |
| Category | Integrated Circuits (ICs) |
| Mfr | Texas Instruments |
| Series | Automotive, AEC-Q100 |
| Package | Tape & Reel (TR)
Cut Tape (CT) Digi-Reel® |
| Product Status | Active |
| Switch Type | General Purpose |
| Number of Outputs | 1 |
| Ratio - Input:Output | 1:1 |
| Output Configuration | High Side |
| Output Type | N-Channel |
| Interface | On/Off |
| Voltage - Load | 2.5V ~ 5.5V |
| Voltage - Supply (Vcc/Vdd) | 0.8V ~ 5.5V |
| Current - Output (Max) | 4A |
| Rds On (Typ) | 16mOhm |
| Input Type | Non-Inverting |
| Features | Load Discharge, Slew Rate Controlled |
| Fault Protection | - |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Mounting Type | Surface Mount |
| Supplier Device Package | 8-WSON (2x2) |
| Package / Case | 8-WFDFN Exposed Pad |
| Base Product Number | TPS22965 |
What is packaging
After a long process, from design to manufacture, you finally get an IC chip. However, a chip is so small and thin that it can be easily scratched and damaged if it is not protected. Furthermore, because of the tiny size of the chip, it is not easy to place it on the board manually without a larger housing.
Therefore, a description of the package follows.
There are two types of packages, the DIP package, which is commonly found in electric toys and looks like a centipede in black, and the BGA package, which is commonly found when buying a CPU in a box. Other packaging methods include the PGA (Pin Grid Array; Pin Grid Array) used in early CPUs or a modified version of the DIP, the QFP (plastic square flat package).
Because there are so many different packaging methods, the following will describe the DIP and BGA packages.
Traditional packages that have endured for ages
The first package to be introduced is the Dual Inline Package (DIP). As you can see from the picture below, the IC chip in this package looks like a black centipede under the double row of pins, which is impressive. However, because it is mostly made of plastic, the heat dissipation effect is poor and it cannot meet the requirements of current high-speed chips. For this reason, the majority of ICs used in this package are long-lasting chips, such as the OP741 in the diagram below, or ICs that do not require as much speed and have smaller chips with fewer vias.
The IC chip on the left is the OP741, a common voltage amplifier.
The IC on the left is OP741, a common voltage amplifier.
As for the Ball Grid Array (BGA) package, it is smaller than the DIP package and can easily fit into smaller devices. In addition, because the pins are located underneath the chip, more metal pins can be accommodated compared to DIP. This makes it ideal for chips that require a large number of contacts. However, it is more expensive and the connection method is more complex, so it is mostly used in high-cost products.
