Best-Selling Transistors Integrated Circuits - Electronic Components Original IC chip BOM List Service BGA668 XC4VLX25-10FFG668C IC FPGA 448 I/O 668FCBGA – Yingnuode
Best-Selling Transistors Integrated Circuits - Electronic Components Original IC chip BOM List Service BGA668 XC4VLX25-10FFG668C IC FPGA 448 I/O 668FCBGA – Yingnuode Detail:
Product Attributes
| TYPE | DESCRIPTION |
| Category | Integrated Circuits (ICs) Embedded FPGAs (Field Programmable Gate Array) |
| Mfr | AMD Xilinx |
| Series | Virtex®-4 LX |
| Package | Tray |
| Standard Package | 1 |
| Product Status | Active |
| Number of LABs/CLBs | 2688 |
| Number of Logic Elements/Cells | 24192 |
| Total RAM Bits | 1327104 |
| Number of I/O | 448 |
| Voltage – Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 668-BBGA, FCBGA |
| Supplier Device Package | 668-FCBGA (27×27) |
| Base Product Number | XC4VLX25 |
Latest Developments
Following Xilinx’s official announcement of the world’s first 28nm Kintex-7, the company has recently revealed for the first time details of the four 7 Series chips, Artix-7, Kintex-7, Virtex-7, and Zynq, and the development resources surrounding the 7 Series.
All 7 series FPGAs are based on a unified architecture, all on a 28nm process, giving customers the functional freedom to reduce cost and power consumption while increasing performance and capacity, thereby reducing the investment in the development and deployment of low-cost and high-performance families. The architecture builds on the highly successful Virtex-6 family of architectures and is designed to simplify the reuse of current Virtex-6 and Spartan-6 FPGA design solutions. The architecture is also supported by the proven EasyPath. FPGA cost reduction solution, which ensures a 35% cost reduction without incremental conversion or engineering investment, further increasing productivity.
Andy Norton, CTO for System Architecture at Cloudshield Technologies, a SAIC company, said: “By integrating the 6-LUT architecture and working with ARM on the AMBA specification, Ceres has enabled these products to support IP reuse, portability, and predictability. A unified architecture, a new processor-centric device that changes the mindset, and a layered design flow with next-generation tools will not only dramatically improve productivity, flexibility, and system-on-chip performance, but will also simplify the migration of previous generations of architectures. More powerful SOCs can be built thanks to advanced process technologies that allow significant advances in power consumption and performance, and the inclusion of the A8 processor hardcore in some of the chips.
Xilinx Development History
Oct 24, 2019 – Xilinx (XLNX.US) FY2020 Q2 revenue up 12% YoY, Q3 expected to be a low point for the company
December 30, 2021, AMD’s $35 billion acquisition of Ceres is expected to close in 2022, later than previously planned.
In January 2022, the General Administration of Market Supervision decided to approve this operator concentration with additional restrictive conditions.
On 14 February 2022, AMD announced that it had completed its acquisition of Ceres and that former Ceres board members Jon Olson and Elizabeth Vanderslice had joined the AMD board.
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